Glossary of Terms

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  • ESD:Electrostatic discharge, the static charge that is built up that can amount to several thousand volts. Can destroy electronic components.
  • Example:PC, wire lug, quick-connect, wirewrap, etc. Please refer to the ITW Switches Characteristics/Circuits for more detail.
  • Fixed Contact (Stationary Contact):The non-moving contact. Typically, integral to the end of the terminal inside the switch body.
  • Flash Plating:Plating thickness of 10 micro inches (0.00001) or less, typically done with gold plate.
  • Flux:Chemical used for cleaning metal surfaces for welding. Fluxes turn contaminated metal surfaces into clean, solderable part.
  • Force (Contact):The force, holding closed contact together.
  • Form A:A single pole, single throw, normally open contact or SPST NO.
  • Form B:A single pole, single throw, normally closed contact or SPST NC.
  • Form C:A single pole, double throw contact or SPDT.
  • Form / Switch Form:Please refer to the ITW Switches Characteristics/Circuits for more detail.
  • Form Z:A two circuit double break switch such as a Single Pole Double Throw Double Break switch.
  • Free Position:The position of the button or toggle of a switch in its normal position. The free position is usually measured from the center of the mounting holes to the top of the button on a basic switch or from the top of the button to a reference point on a pushbutton switch.
  • Gap:The shortest straight-line distance between two separate contacts.
  • Gated:Restricted movement in XY axis only.
  • Gold Flash:A plating of gold typically less than 10 micro-inches (millionths) thick. Used only as a barrier to oxidation or corrosion of terminals to maintain solderability.